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EN29F002NT ÃÖ¼ÒÁÖ¹®¼ö·® : 10°³ |
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EN29F002 / EN29F002N 2 Megabit (256K x 8-bit) Flash Memory
FEATURES ¡¤ 5.0V ¡¾ 10% for both read/write operation ¡¤ Read Access Time - 45ns, 55ns, 70ns, and 90ns ¡¤ Fast Read Access Time - 70ns with Cload = 100pF - 45ns, 55ns with Cload = 30pF ¡¤ Sector Architecture: One 16K byte Boot Sector, Two 8K byte Parameter Sectors, one 32K byte and three 64K byte main Sectors ¡¤ Boot Block Top/Bottom Programming Architecture ¡¤ High performance program/erase speed - Byte program time: 10¥ìs typical - Sector erase time: 500ms typical - Chip erase time: 3.5s typical ¡¤ Low Standby Current - 1¥ìA CMOS standby current-typical - 1mA TTL standby current ¡¤ Low Power Active Current - 30mA active read current - 30mA program / erase current ¡¤ JEDEC Standard program and erase commands ¡¤ JEDEC standard DATA polling and toggle bits feature ¡¤ Hardware RESET Pin (n/a for EN29F002N) ¡¤ Single Sector and Chip Erase ¡¤ Sector Protection / Temporary Sector Unprotect (RESET = VID) ¡¤ Sector Unprotect Mode ¡¤ Embedded Erase and Program Algorithms ¡¤ Erase Suspend / Resume modes: Read and program another sector during Erase Suspend Mode ¡¤ 0.4 ¥ìm double-metal double-poly triple-well CMOS Flash Technology ¡¤ Low Vcc write inhibit < 3.2V ¡¤ 100K endurance cycle ¡¤ Package Options - 32-pin PDIP - 32-pin PLCC - 32-pin TSOP (Type 1) ¡¤ Commercial and Industrial Temperature Ranges
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